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VIA ARTiGO Pico-ITX Kit Highlighted at ESC Silicon Valley Keynote, BYOES Track and Microsoft SPARK Your Imagination Program
San Jose, California, 16 April 2008 - VIA Technologies, Inc, a leading innovator of embedded silicon and platform technologies, today announced that the VIA ARTiGO Pico-ITX builder kit has been selected as the platform for the Build Your Own Embedded System track, a new hands-on embedded system development lab at Embedded Systems Conference Silicon Valley, taking place in San Jose from 14-18 April.
VIA ARTiGO Pico-ITX Kit Highlighted at ESC Silicon Valley Keynote, BYOES Track and Microsoft SPARK Your Imagination Program
San Jose, California, 16 April 2008 - VIA Technologies, Inc, a leading innovator of embedded silicon and platform technologies, today announced that the VIA ARTiGO Pico-ITX builder kit has been selected as the platform for the Build Your Own Embedded System track, a new hands-on embedded system development lab at Embedded Systems Conference Silicon Valley, taking place in San Jose from 14-18 April.
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Illustrating the suitability of the super-compact system for x86 embedded design, the VIA ARTiGO will also be featured in the Microsoft conference keynote, and is one of the primary VIA platform offerings for the Microsoft SPARK Your Imagination program, aimed at spurring innovative embedded system development among academics and hobbyists.
Visitors to ESC Silicon Valley will be able to catch up with the VIA ARTiGO and many other leading VIA embedded x86 technologies at the VIA booth 2110.
"We are excited to be featuring the VIA ARTiGO builder kit as an offering in our SPARK Your Imagination program," said Scott Davis, Senior Marketing Manager, Microsoft Windows Embedded Academic & Community Programs. "The SPARK program demonstrates Microsoft's commitment to the developer community by making leading development tools available to hobbyist developers and academics, helping to foster their creativity and drive innovation in the industry."
Keynote: During the Microsoft Industry Address on Wednesday 16th April, Kevin Dallas and Mike Hall, General Manager and Software Architect respectively of the Windows Embedded Group, will define the evolution of embedded devices and their increasing integration into networked and service-based applications, highlighting the importance of creating an environment to facilitate those designs quickly and easily. The VIA ARTiGO will be used in two demonstrations highlighting two of the Windows Embedded innovations helping to drive these market changes.
BYOES Track: The Build Your Own Embedded System (BYOES) is a new track at ESC and has been sponsored by Microsoft Windows Embedded as a unique learning experience for developers. Working closely with system experts, attendees can design and build a real, practical embedded system, customizing a VIA ARTiGO to meet their device needs, and learn how to implement wireless and network connectivity, and GPS, web server and other key applications within the Windows Embedded CE 6.0 R2 environment. At the end of the event, each attendee gets to keep their newly configured VIA ARTiGO embedded system.
"We are delighted that Microsoft will leverage the small size and software compatibility of our ARTiGO Pico-ITX builder kit in both their keynote and the 'Build Your Own Embedded System' track at ESC," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. "Not only does the tiny system serve as the ideal platform for today's x86 embedded devices, it underlines a perfect fit of Microsoft's embedded software and VIA's power efficient, highly integrated hardware."
Illustrating the suitability of the super-compact system for x86 embedded design, the VIA ARTiGO will also be featured in the Microsoft conference keynote, and is one of the primary VIA platform offerings for the Microsoft SPARK Your Imagination program, aimed at spurring innovative embedded system development among academics and hobbyists.
Visitors to ESC Silicon Valley will be able to catch up with the VIA ARTiGO and many other leading VIA embedded x86 technologies at the VIA booth 2110.
"We are excited to be featuring the VIA ARTiGO builder kit as an offering in our SPARK Your Imagination program," said Scott Davis, Senior Marketing Manager, Microsoft Windows Embedded Academic & Community Programs. "The SPARK program demonstrates Microsoft's commitment to the developer community by making leading development tools available to hobbyist developers and academics, helping to foster their creativity and drive innovation in the industry."
Keynote: During the Microsoft Industry Address on Wednesday 16th April, Kevin Dallas and Mike Hall, General Manager and Software Architect respectively of the Windows Embedded Group, will define the evolution of embedded devices and their increasing integration into networked and service-based applications, highlighting the importance of creating an environment to facilitate those designs quickly and easily. The VIA ARTiGO will be used in two demonstrations highlighting two of the Windows Embedded innovations helping to drive these market changes.
BYOES Track: The Build Your Own Embedded System (BYOES) is a new track at ESC and has been sponsored by Microsoft Windows Embedded as a unique learning experience for developers. Working closely with system experts, attendees can design and build a real, practical embedded system, customizing a VIA ARTiGO to meet their device needs, and learn how to implement wireless and network connectivity, and GPS, web server and other key applications within the Windows Embedded CE 6.0 R2 environment. At the end of the event, each attendee gets to keep their newly configured VIA ARTiGO embedded system.
"We are delighted that Microsoft will leverage the small size and software compatibility of our ARTiGO Pico-ITX builder kit in both their keynote and the 'Build Your Own Embedded System' track at ESC," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. "Not only does the tiny system serve as the ideal platform for today's x86 embedded devices, it underlines a perfect fit of Microsoft's embedded software and VIA's power efficient, highly integrated hardware."