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In Q3, SiS will move to 130 nanometers.
Due to their high density, graphics chips are usually the product that companies use to test advanced processing. Judging from SiSs product roadmap, its Xabre II, which is set to be launched in the fourth quarter, is likely to be SiSs first product manufactured with 0.13-micron technology. Its Xabre 600 graphics chip, scheduled to hit the market in the third quarter, should still adopt the older process.
In Q3, SiS will move to 130 nanometers.
Due to their high density, graphics chips are usually the product that companies use to test advanced processing. Judging from SiSs product roadmap, its Xabre II, which is set to be launched in the fourth quarter, is likely to be SiSs first product manufactured with 0.13-micron technology. Its Xabre 600 graphics chip, scheduled to hit the market in the third quarter, should still adopt the older process.